Case Study 1 - Columbia University's 1024 Node SuperComputer for Dept of Energy

Columbia University, Brookhaven National Lab -- Columbia University's 1024 Node SuperComputer for Dept of Energy

Columbia University, the University of Edinburgh, the RIKEN BNL Research Center, Brookhaven National Lab, and Elma Electronic all contributed to the project. The system utilized approximately 9U by 26" deep motherboards by Columbia University in a very densely packaged unit. The result was the first 1024 node 840 Gflop supercomputer.

Elma was tasked in providing a backplane/chassis/cabinet solution for one of the most advanced supercomputers in the world. The cabinets and backplanes had to match the special dimensions of 9U mother boards and daughter cards and permit the massive cabling needed to wire up a 6-dimensional mesh communications scheme.

The initial prototypes used a single slot backplane and the production units use an 8-slot design. Utilizing the high-speed ZD connector and precise differential pair routing, the backplanes have an aggregate a multi-Gflops bandwidth.

The backplane has a number of active components, a 48 to 3.3 volt converter and 33 MHz clock generation and distribution circuitry. The backplane had to have a special 0.20" thickness to permit press-fit connectors to be mounted in both sides of the same through-hole. Elma Bustronic's expertise in high-speed design helped provide a superb solution with excellent signal integrity. A stiffener set was also designed for the tall and dense motherboards to prevent backplane bowing.

Elma Bustronic also developed the system monitors. The cabinets contain an elaborate, web-accessible control and monitoring system, allowing temperatures, fan condition, humidity, and voltages to be monitored remotely. The water inlet and outlet temperature, water pressure, leak detection, smoke/fire detector was also monitored by the system. In addition, the system can remotely power cycle the machine as well as change the set-points for many of the safety cut-outs. This was all designed and integrated by Elma. [top]

Case Study 2 - MIT Lincoln Laboratory - TSAT Custom Backplane

The MIT Lincoln custom backplane physical size was 16" W x 10.5" H and supported up to ten double-width VME cards. The backplane has a combination of 96-pin DIN and high speed HM-ZD connectors. Xilinx RocketIO 100 ohm differential pair signals were transmitted across the backplane in a daisy-chain topology. SMA connectors were used to connect to on-board test routing. This custom backplane had 18 layers controlled-impedance construction with a PCB .151" thick. The PCB is high grade Nelco 4000-13SI material for signal integrity. The low dielectric material helps maintain a cleaner channel signal.

Elma Bustronic was chosen for our expertise in custom design and our ability to work with the customer in assuring signal integrity. Some pre-design simulation was performed as well as post-design characterization. Elma Bustronic performed S-parameter models and looked at the impedance, crosstalk, skew, and created eye diagrams for analysis. The results of the measurements were very strong. [top]

Case Study 3 - Telecom I (Customer Requested Anomymity)

This large telecom backplane had dimensions of 480 x 733 x 7.5 mm. The company was able to design the backplane in only 16 layers. The design allowed front-removeable power supplies to be directly plugged into the backplane. The backplane has ground screening surfaces, TTL, BTL, and GTL and logic level. Another key element of the backplane design was special EMC precautions and lightning protection were built into the design.

The Elma group was chosen for our strength in custom design and large telecom backplane expertise. The company has experience with telecom backplanes of all sorts, with layer counts as high as 36 layers.[top]

Case Study 4 - Telecom II

Another large telecom backplane, this custom design had dimensions of dual 478 x 485 mm sections. The company was able to design the backplane in only 16 layers, and had over 11, 000 via holes. The design had 148 differential ECL control lines with 100 ohm characteristic impedance. This custom design also featured lightning protection built into the design.

The Elma group was chosen for our strength in custom design and large telecom backplane expertise. The company has experience with telecom backplanes of all sorts, with layer counts as high as 36 layers. [top]

Case Study 5 - Guided Missile Application

This application was for a guided missile for the military. The design used the 2mm HM connector and custom routing. The backplane was a 6-slot 3U design, with a 32-bit custom bus. This was a case where Elma Bustronic was given a netlist, and simply routed, fabricated, and assembled the backplane. We saved the customer time, effort, and money with our design expertise and rapid ability to solve problems and finish the job.

The 8-layer controlled impedance stripline design had two 2 oz. copper ground planes fully the shielding backplane minimizing EMI/RFI emissions susceptibility. Conformal coating added extra protection to the backplane. [top]

Case Study 6 - University of Maryland, Space Systems Lab Robotic Arm

This application was for a robotic arm for the Ranger Telerobotic Shuttle Experiment. Actually, this project was three backplanes in one - the arm, elbow, and wrist of the robotic arm. The rugged Eurocard-based design and conformal coating helped protect the backplane. RTSX intended to demonstrate telerobotic servicing on International Space Station Orbit Replaceable Units (ORUs) and EVA equipment in the Space Shuttle cargo bay. Ranger TSX was designed as a four manipulator telerobot with one permanently attached to a Spacelab pallet. The manipulators perform dexterous manipulation, body repositioning, and stereo video viewing. Ranger TSX was an Integrated Product Development effort with participation from other NASA centers, universities, and industry. A 12-layer controlled-impedance stripline design was used.

Elma Bustronic was chosen for our quality design and experience in high-performance custom backplane design. More details of the application are available at http://rtsx.ssl.umd.edu [top]

Case Study 7 - Northrop Grumman - Custom Adapter Cards

Since it's initial introduction in the mid-1990s, the E-2C CP-2319/ASQ Mission Computer has received several software upgrades that enhanced the operational effectiveness of the weapon system. Impact to the existing CP-2319/ASQ Mission Computer hardware was minimized through the use of custom VME and PCI adapter cards developed by Elma Bustronic for Northrop Grumman. The VME and PCI adapter cards provide both the mechanical and electrical interface between the COTS components and the customized backplanes in the Mission Computer.

The VME adapter designed by Elma Bustronic can accommodate up to two (2) COTS SBCs, a COTS Network Switch, and a COTS DC-DC power converter. The PCI adapter provides both the mechanical and electrical interface between a COTS Dual Compact PCI Mezzanine Card (DCPMC) and the custom PCI backplane. The adapter cards had conformal coating for environmental protection. They were designed in a 10-layer stripline design. The custom adapters solution will facilitate future upgrades and extend the operational viability of the Hawkeye 2000. [top]